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Broadcom’s New family of Bluetooth headset Chips

Thursday, October 29, 2009
Broadcom recently announced its latest series of Bluetooth silicon. Broadcom’s new system-on-a-chip CMOS Bluetooth radios use 65 nanometer processes, and this new family of Bluetooth solutions leapfrogs the competition by delivering superior audio quality, key user interface enhancements and unrivaled power performance and talk time.

According to Broadcom, the BCM2074x family of Bluetooth headset chips has new wind and noise reduction algorithms, support for multiple language voice prompts, and the ability to charge five times faster than existing products.

The 65nm processes also contributes to better power management, and Broadcom says this new series of chips should offer double the talk time when compared to its previous series of Bluetooth products. The chips support Bluetooth versions 2.0, 2.1 and 3.0 and are already sampling.

Source: http://broadcom.com/press/release.php?id=s417679&industry_id=2

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